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About Simax

Simax provides a complete portfolio of engineering services for semiconductor manufacturing equipment and helps customers to optimize their lithography equipment for new and emerging applications. Simax' services include pre-owned equipment, engineering services, field support and applications services as well as financial services.

We support steppers and scanners from ASML and Nikon as well as Canon and other manufacturers for wafer sizes of 200mm and below. Simax also provides parts, parts and module repair, system refurbishment, equipment audits and deinstallations.

Our engineering and applications services support long-term use and optimization of lithography equipment anywhere in the world. The combination of first-class support with a cost-efficient operation increases the lifetime value of equipment and production lines, providing exceptional customer value.

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Best Solutions

Full Field Dose to Clear Technique

A significant part of a process engineer’s job is to develop simple and effective monitors that employ minimal non-productive equipment time - Dose To Clear or DTC is one such test.

Innovative Sub-resolution Technique

Successful process development, using existing equipment, extended beyond its defined specification limits is a tribute to a process engineer’s innovative creativity.

News

This series chronicles a number of historical lithographic milestones that were critical to the success of the TFH market’s growth and ability to continuously increase hard drive capacity at the lowest possible cost.


Part 1: "Imaging high aspect ratio features”

The Thin Film Head is one of the most successful MEMS devices ever built. In the late 1990’s TFH manufacturers were struggling with a technology node transition, from i-line (365nm) to DUV (248nm). How far could i-line resist processing be extended, especially for electroplating layers that required high aspect ratio imaging? Conventional i-line materials quickly ran out of steam for high aspect ratio imaging, so chemically amplified i-line resists were employed to extend this capability. However, with the development of new thick DUV resist materials, which had both the resolution and aspect ratio advantages, the move to DUV followed rapidly.

 

TFH-Aug2010

An interesting TFH presentation from ASML shows this in more detail, with some very nice SEM cross sections For more information on TFH processing and high aspect ratio imaging, please This e-mail address is being protected from spambots. You need JavaScript enabled to view it. at simaxlithography.com