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About Simax

Simax provides a complete portfolio of engineering services for semiconductor manufacturing equipment and helps customers to optimize their lithography equipment for new and emerging applications. Simax' services include pre-owned equipment, engineering services, field support and applications services as well as financial services.

We support steppers and scanners from ASML and Nikon as well as Canon and other manufacturers for wafer sizes of 200mm and below. Simax also provides parts, parts and module repair, system refurbishment, equipment audits and deinstallations.

Our engineering and applications services support long-term use and optimization of lithography equipment anywhere in the world. The combination of first-class support with a cost-efficient operation increases the lifetime value of equipment and production lines, providing exceptional customer value.

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Best Solutions

Full Field Dose to Clear Technique

A significant part of a process engineer’s job is to develop simple and effective monitors that employ minimal non-productive equipment time - Dose To Clear or DTC is one such test.

Innovative Sub-resolution Technique

Successful process development, using existing equipment, extended beyond its defined specification limits is a tribute to a process engineer’s innovative creativity.

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Part 3: "Epi shift and washout solutions”

There are of course a number of possible solutions to solve both “Epi shift” and target washout, but in my opinion the most production worthy is ASML’s 3D align in Back to Back Alignment (BTBA) mode. BTBA mode uses PM targets on the backside of the wafer in conjunction with the 3D alignment system to decouple process from alignment.

epi-shift-washout

 

This approach has been described in a number of publications for various applications including this CMP and thick film Epitaxy - “small times” magazine article.


With this solution, both the “Epi shift” and target washout problems are resolved. Moreover, from a process engineering perspective, BTBA could be used to determine the elusive epitaxy shift factor and mean “Epi shift”. Can you solve the puzzle?


For the answer to the puzzle, or more discussion about the challenges of thick epitaxy, please This e-mail address is being protected from spambots. You need JavaScript enabled to view it. at simaxlithography.com