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About Simax

Simax provides a complete portfolio of engineering services for semiconductor manufacturing equipment and helps customers to optimize their lithography equipment for new and emerging applications. Simax' services include pre-owned equipment, engineering services, field support and applications services as well as financial services.

We support steppers and scanners from ASML and Nikon as well as Canon and other manufacturers for wafer sizes of 200mm and below. Simax also provides parts, parts and module repair, system refurbishment, equipment audits and deinstallations.

Our engineering and applications services support long-term use and optimization of lithography equipment anywhere in the world. The combination of first-class support with a cost-efficient operation increases the lifetime value of equipment and production lines, providing exceptional customer value.

Best Solutions

Full Field Dose to Clear Technique

A significant part of a process engineer’s job is to develop simple and effective monitors that employ minimal non-productive equipment time - Dose To Clear or DTC is one such test.

Innovative Sub-resolution Technique

Successful process development, using existing equipment, extended beyond its defined specification limits is a tribute to a process engineer’s innovative creativity.

Part 2: "Epi shift"

“Epi shift” is the term given to the X, Y translational displacement of alignment targets and device patterns, which is a function of epitaxy thickness. This displacement is often quite large, roughly 0.4um to 0.9um for every 1um of epitaxy grown.

 

epitaxy

 

This phenomenon is most prevalent in the <111> orientation crystal plane and is well described in this article in Solid-State-Technology magazine

In this particular case, what looked like an overlay problem, turned into an epitaxy reactor characterization study since epitaxy thickness variation induced a variation in translation standard deviation due to the relationship of dx to dz. Of course, to measure the mean value of epi shift you would need to uncover a target at the substrate/epitaxy interface, buried beneath the thick epitaxy. To recover such a target has proved to be very difficult, so SEM cross sections are typically used to determine this value. Next month, we will discuss a novel solution that can be used to quantify both the mean “epi shift” and the epitaxy thickness variation.


For more discussion about “epi shift “and metrology solutions, please This e-mail address is being protected from spambots. You need JavaScript enabled to view it. at simaxlithography.com